Silicon Wafer Reclaim Solutions
SPECIFICATION, WAFER RECLAIM SERVICE
Incoming Inspection:
Upon receipt of material, Applied Watts visually inspects wafers for chips, cracks, film types. Defective wafers will be rejected and returned unprocessed.
Wafers are chemically stripped.
Wafers are polished.
Wafers are cleaned utilizing RCA/SC1/SC2 Process.
Standard Specifications:
Inspection Criteria Reject Accept
Finger Prints 100% 0%
Chips/Cracks 100% 0%
Water Spots/Streaks 100% 0%
Edge Exclusion ≥3mm ≤3mm
Wand Marks 100% 0%
Micro-Scratches ≥1.25 inches in length ≤1.25 inches in length
Pitting (Depth of removal <6um) ≥3% ≤3%
Wafer Thickness ≤675µm ≥700µm
Resistivity <1.0Ω/cm, >1.0Ω/cm
This document contains proprietary information of APPLIED WATTS – CALIFORNIA USA and is tendered subject to the conditions that the information (a) be retained in confidence, (b) not be reproduced or copied in whole or in part and ( c) not be used or incorporated in any product, except under an express written agreement with Applied Watts (www.appliedwatts.com)
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