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Process Data Sheets
Wafer Reclaim
Thermal Oxide & LPCVD Processes
Advanced Lithography
Back Grinding
Resist Spin Coating
Polish - Clean - Grind
Mirror finish polishing, high quality slurries, multi-step cleaning. Single and double-sided grinding for all wafer grades
Etch Capabilities
Silicon - Optical Grade
Monocrystalline, purity >99.999%, <100> <111> orientation, conductivy; n type (Phosphorus doped) p type (boron doped)
Thermal Solutions
Sub 0 to 750C, resistive heat, sensing and controllers to 1% accuracy. Silicone sheath gas lines, RTD's and T/C's, Ceramic and Stainless heaters, and Flexible Fiberglass Heaters.
Laser Cutting
Alumina - AL Nitride - Berylium Oxide - ALN - Silicon - Quartz - Sapphire - Zicronia
High quality, volume, and precision 500 watt CO2 laser systems with multiple heads that scribe and drill off a 17" workspace.
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