Silicon
Wafer Reclaim
Refined wafer reclaim inspection 100mm - 300mm transfered to cassettes free of contaminants.
*Particles as low as @ 0.09um (COPS excluded)
*Typical Metal Performance <2E10 atoms.cm2
*Precision dimensional and optical data
*Full CofA data, including type - res - thickness particles and other requirements.
Silicon - Optical Grade
Monocrystalline, purity >99.999%, <100> <111> orientation, conductivy; n type (Phosphorus doped) p type (boron doped) data sheet available.
Thermal Oxide & LPCVD
Guaranteed 5% industry standard uniformity 76-300mm
Back Grinding
Back grinding is a process that removes silicon from the back surface of a wafer. AW provides grinding on our own substrates or on customer supplied wafers. We process bare and device patterned wafers with high yield and offer wafer thinning to customer specifications.
Grinding Capabilities:
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Diameters: 25mm (1 inch) – 300mm (12 inch)
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Final wafer thickness for 50mm to 200mm: >=50 um
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Final Wafer Thickness for 300mm wafers only: >=80 um
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Back surface Finish: Ground, lapped, or polished
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Typical Yield: >=95%
